[PATCH 2/4] Revert "dt-bindings: vendor-prefixes: Document Chongzhou"
Jagan Teki
jagan at edgeble.ai
Mon Jan 23 16:40:16 UTC 2023
This reverts commit 90f86d0c617d9461cb00f4d8e861eda28011d46e.
[why]
The initial datasheet claimed that chouzhong designed the 10" DSI
panel on top of JD9365DA IC, but later Radxa mentioned that chouzhong
is the manufacturer. This concludes that the actual design of the
panel, gsensor, and customized FPC is done by Radxa.
So, drop the Chongzhou vendor-prefix as it is no longer useful
anywhere in the bindings.
Reported-by: Tom Cubie <tom at radxa.com>
Signed-off-by: Jagan Teki <jagan at edgeble.ai>
---
Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 --
1 file changed, 2 deletions(-)
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
index 70ffb3780621..f5d0e75dab1f 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
+++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
@@ -248,8 +248,6 @@ patternProperties:
description: ChipOne
"^chipspark,.*":
description: ChipSPARK
- "^chongzhou,.*":
- description: Shenzhen Chongzhou Electronic Technology Co., Ltd
"^chrontel,.*":
description: Chrontel, Inc.
"^chrp,.*":
--
2.25.1
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